Mochini o tlamang ka mohala
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Semiconductor IC Bonding Equipment/Aluminium Wedge Bonding Machine GR-W01
Bakeng sa libeteri tse ncha tsa matla, li-inverters tsa photovoltaic, lisebelisoa tsa elektroniki tsa likoloi, polokelo ea matla, IGBT, liboto tsa taolo ea polokeho ea betri ea BMS, joalo-joalo;
Mochine ona o kopanyang terata o ne o ka lumellana le aluminium le khoele ea koporo;
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Aluminium Wire Bonding Machine bakeng sa TO Series Wire Bonding -Wedge Bonding ICs/GR-W02
Mochini o khethehileng oa terata o nang le mohala o le mong TO;
GR-W02 ke mochini o kopanyang terata o loketseng lisebelisoa tsa matla, sehlahisoa se lumellana le mola o le mong ho ea ho liphutheloana le moralo oa li-ultrasonic tse ngata, bonder e sebelisoa kamora palo e kholo ea ntlafatso e pheta-phetoang, e sebelisa li-motor tse tsitsitseng le tse tšepahalang, coil ea lentsoe. li-motors, litsamaiso tsa ultrasonic bakeng sa tlhahiso. Ho phaella moo, bokhoni bo atolositsoeng ba ho lemoha mokhoa oa sesebelisoa bo fana ka tlhahiso le ho tšepahala ho indasteri.
