Mochini o tlamang ka mohala
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Semiconductor IC Bonding Equipment/Aluminium Wedge Bonding Machine GR-W01
Bakeng sa libeteri tse ncha tsa matla, li-inverters tsa photovoltaic, lisebelisoa tsa elektroniki tsa likoloi, polokelo ea matla, IGBT, liboto tsa taolo ea polokeho ea betri ea BMS, joalo-joalo;
Mochine ona o kopanyang mohala o ne o ka tsamaisana le aluminium le khoele ea koporo ea terata;
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Aluminium Wire Bonding Machine bakeng sa TO Series Wire Bonding -Wedge Bonding ICs/GR-W02
Mochini o khethehileng oa terata o nang le mohala o le mong TO;
GR-W02 ke mochine o kopanyang terata o loketseng lisebelisoa tsa matla, sehlahisoa se lumellana le mola o le mong ho ea ho li-packaging tse ngata tsa ultrasonic le moralo, bonder e sebelisoa ka mor'a palo e kholo ea ntlafatso e pheta-phetoang, ho sebelisa li-motor tse tsitsitseng le tse ka tšeptjoang, li-motor coil tsa lentsoe, mekhoa ea ultrasonic bakeng sa tlhahiso. Ho phaella moo, bokhoni bo atolositsoeng ba ho lemoha mokhoa oa sesebelisoa bo fana ka tlhahiso le botšepehi bo etellang pele indastering.
