Kopo ho indasteri ea Semiconductor
GREEN ke Kgwebo ya Naha ya High-Tech e inehetseng ho R&D le ho etsa dikopano tsa elektronike tse itirisang le thepa ya ho paka le ho etsa diteko tsa semiconductor. Ho sebeletsa baetapele ba indasteri joalo ka BYD, Foxconn, TDK, SMIC, Canadian Solar, Midea, le likhoebo tse ling tse 20+ tsa Fortune Global 500. Molekane oa hau eo u mo tšepang bakeng sa litharollo tse tsoetseng pele tsa tlhahiso.
Mechini e kopanyang e nolofalletsa li-micro-interconnect tse nang le bophara ba terata, ho netefatsa botšepehi ba pontšo; formic acid vacuum soldering e etsa manonyeletso a ka tšeptjoang tlas'a litaba tsa oksijene <10ppm, ho thibela ho hlōleha ha oxidation ka har'a liphutheloana tse phahameng; AOI e thibela bofokoli ba boemo ba micron. Synergy ena e netefatsa> 99.95% tlhahiso e tsoetseng pele ea ho paka, e kopanang le litlhoko tse feteletseng tsa liteko tsa 5G/AI chips.
Ultrasonic Wire Bonder
E khona ho kopanya terata ea aluminium ea 100 μm–500 μm, terata ea koporo e 200 μm–500 μm, liribone tsa aluminium tse fihlang ho 2000 μm ka bophara le 300 μm tse botenya, hammoho le likhopo tsa koporo.
Sebaka sa maeto: 300 mm × 300 mm, 300 mm × 800 mm (e ka khoneha), ka ho pheta-pheta <±3 μm
Sebaka sa maeto: 100 mm × 100 mm, ka ho pheta-pheta <± 3 μm
Theknoloji ea Wire Bonding ke eng?
Khokahano ea mohala ke mokhoa oa khokahano oa microelectronic o sebelisoang ho hokahanya lisebelisoa tsa semiconductor ho liphutheloana tsa tsona kapa li-substrates. E le e 'ngoe ea mahlale a bohlokoa ka ho fetisisa indastering ea semiconductor, e thusa ho hokahanya ha chip le lipotoloho tsa kantle ho lisebelisoa tsa elektroniki.
Bonding Wire Materials
1. Aluminium (Al)
Superior electro conductivity vs. khauta, theko e tlaase
2. Koporo (Cu)
25% e phahameng ea motlakase / mocheso oa motlakase ho feta Au
3. Khauta (Au)
Optimate conductivity, corrosion resistance, le bonding ho tšepahala
4. Silevera (Ag)
Phahameng ka ho fetisisa conductivity har'a tšepe
Mohala oa Aluminium
Aluminium Ribone
Mohala oa Koporo
Ribone ea Koporo
Semiconductor Die Bonding & Wire Bonding AOI
E sebelisa kh'amera ea indasteri ea 25-megapixel ho bona mefokolo ea "die attach" le "wire bonding" lihlahisoa tse kang ICs, IGBTs, MOSFETs, le liforeimi tse etellang pele, ho fihlela sekhahla sa ho lemoha sekoli se fetang 99.9%.
Linyeoe tsa Tlhahlobo
E khona ho lekola bolelele ba chip le ho batalla, chip offset, ho sekamela le ho penya; bolo ea solder e sa khomarele le sesole sa motsoako oa solder; bofokoli ba khoele ea terata ho kenyelletsa bolelele bo feteletseng kapa bo sa lekaneng ba loop, ho putlama ha loop, lithapo tse robehileng, lithapo tse sieo, khokahanyo ea terata, ho kobeha ha terata, loop crossing, le bolelele bo feteletseng ba mohatla; sekhomaretsi se sa lekaneng; le splatter ea tšepe.
Solder Ball/ Masala
Chip Scratch
Ho beha Chip, Dimension, Tilt Meas
Tšilafalo ea Chip / Litaba tsa Kantle
Chip Chipping
Ceramic Trench Cracks
Tšilafalo ea Ceramic Trench
AMB oxidation
In-Line Formic Acid Reflow Oven
1. Mocheso o phahameng oa mocheso ≥ 450°C, bonyane ba boemo ba vacuum <5 Pa
2. E tšehetsa maemo a formic acid le nitrogen process
3. Sekhahla sa lefeela sa ntlha e le 'ngoe ≦ 1%, sekhahla se akaretsang sa lefeela ≦ 2%
4. Pholiso ea metsi + pholiso ea naetrojene, e nang le mokhoa oa ho pholile oa metsi le ho pholisa ho kopana
IGBT Power Semiconductor
Litefiso tse feteletseng tsa ho felloa ke matla ho IGBT soldering li ka baka ho hloleha ha ketane ho kenyelletsa ho baleha ha mocheso, ho phatloha ha mechine, le ho senyeha ha motlakase. Ho fokotsa litheko ho isa ho ≤1% ho matlafatsa ts'epehi ea lisebelisoa le ho sebetsa hantle ha matla.
IGBT Production process flowchart
