Mechini e Metsi ea ho Solder e Phahameng e Phahameng e Botala e Ikemetseng ea Duplex Laser Solder Ball Welding Machine
Sesebelisoa sa parameter
tem | boleng |
Mofuta | Mochini oa Soldering |
Boemo | E ncha |
Liindasteri tse sebetsang | indasteri ea fuse, indasteri ea semiconductor, indasteri ea puisano |
Tlaleho ea Teko ea Mechini | Fanetsoe |
Mofuta oa Papatso | Sehlahisoa se Tloaelehileng |
Warranty ea likarolo tsa mantlha | Lilemo tse 1.5 |
Likaroloana tsa mantlha | PLC, Motor, Sekepe sa khatello |
Sebaka sa Showroom | Ha ho letho |
Sebaka sa Tšimoloho | China |
Guangdong | |
Lebitso la Brand | MONAHANA |
Palo ea li-volts | 220V |
Litekanyo | 100*110*165(cm) |
Tšebeliso | terata ya solder |
Tiisetso | 3Lilemo |
Lintlha tsa bohlokoa tsa ho rekisa | Ho nepahala ho phahameng |
Boima (KG) | 500KG |
Mohlala | LAB201 |
Litlhaloso tsa bolo ea solder | 0.15-0.25mm/0.3-0.76mm/0.9-2.0mm(Ha u rata) |
Sistimi ea boemo ba pono | CCD, Qeto ± 5um |
Lipikselse tsa khamera | Lipikselse tse limilione tse 5 |
Mokhoa oa ho laola | PLC + PC Taolo |
Ho nepahala ho pheta-pheta ka mechine | ± 0.02 limilimithara |
Sebaka sa tšebetso | 200mm * 150mm (Ho ka khoneha) |
Sebelisa matla | <2KW/H |
Mohloli oa moea | Moea o hatelitsoeng>0.5 MPa nitrogen>0.5MPa |
Demension ea ka ntle(LW*H) | 1000*1100*1650(mm) |
Likarolo tsa sesebelisoa
1. Ts'ebetso ea ho futhumatsa le marotholi e potlakile 'me e ka phethoa ka hare ho 0.2s;
2. Qetella ho qhibiliha ha bolo ea solder ka nozzle ea solder ntle le ho fafatsa;
3. ha ho phallo, ha ho na tšilafalo, ho eketsa bophelo ba lisebelisoa tsa elektroniki;
4. Bophahamo bo fokolang ba bolo ea solder ke 0.15mm, e lumellanang le mokhoa oa tsoelo-pele oa ho kopanya le ho nepahala;
5. Welding ea manonyeletso a fapaneng a solder e ka phethoa ka khetho ea boholo ba bolo ea solder;
6. E tsitsitseng boleng ba tjheseletsa le sekhahla se phahameng sa chai;
7. Sebelisana le tsamaiso ea boemo ba CCD ho finyella litlhoko tsa tlhahiso ea boima ba kopano;
8. UPH > lintlha tse 8000, lihlahisoa > 99% (ho fapana ho ea ka sehlahisoa se fapaneng)
Sebaka sa kopo
kh'amera/mojule ea CCM, monoana oa khauta/FPC, terata, sesebelisoa sa puisano, sesebelisoa sa optical, indasteri ea fuse, solder ea indasteri ea semiconductor.
Sebaka sa Kopo
Laser solder ball welding e hlokomela sehlopha se nepahetseng: PCB pad le khokahano ea solder ea menoana ea khauta, FPC le PCB welding, rod ea terata le
PCB tjheseletsa, karolo ea THT plug-in sesebelisoa soldering. Lihlahisoa tse nang le li-PIN ka lehlakoreng le le leng 'me li kopanya lihlahisoa tse nang le li-PIN ka bobeli
mahlakoreng, le lihlahisoa tse ling tse ngata tse nepahetseng tsa welding.