Double Tin Ball Laser Soldering Machine LAB201
Tlhaloso ea Mochine
Mohlala | LAB201 | |
Laser parameters | Matla | 150W |
Wavelength | 1064 | |
Mokhoa | Li-lasers tse tsoelang pele tsa pulse fiber | |
Litlhaloso tsa bolo ea solder | 0.15-0.25mm/0.3-0.76mm/0.9-2.0mm(Ha u rata) | |
Sistimi ea boemo ba pono | CCD, qeto ± 5 um | |
Lipikselse tsa khamera | Lipikselse tse limilione tse 5 | |
Mokhoa oa ho laola | PLC + PC Taolo | |
Ho nepahala ho ipheta-pheta | Setšoantšo sa 0.02 mm | |
Sebaka sa tšebetso | 200mm * 150mm(E ikemiselitsoeng) | |
Matla a ho sebetsa | <2KW/H | |
Mohloli oa moea | Moea o hatelitsoeng>0.5 MPa nitrogen > 0.5 MPa | |
Boemo ba ka ntle(L*W*H) | 1000*1100*1650(mm) | |
Boima ba 'mele | 500KG |
Likaroloana
1.Lebelo la ho futhumatsa le potlakile, 'me boemo bo nepahetse, bo ka phethoang ka metsotsoana ea 0.2;
2.Libolo tsa solder li ntšoa ho tloha molomong o khethehileng 'me li koahela ka ho toba liphahlo.
3.Ha ho na flux e eketsehileng kapa lisebelisoa tse ling tse hlokahalang, ha ho na tšilafalo e hlahisoang, e leng ho eketsang nako ea bophelo ea lisebelisoa tsa elektroniki;
4.E ts'ehetsa bonyane bophara ba 0.15mm bakeng sa libolo tsa thini, thepa ena ea ho tjheseletsa bolo ea laser tin e lumellana le mokhoa oa nts'etsopele oa lisebelisoa tse kopanetsoeng le tse nepahetseng tsa tlhahiso;
5.Different solder manonyeletso ka tjheseletsa ka ho khetha boholo ba bolo ea solder;
6.Stable tjheseletsa boleng le tekanyo e phahameng chai;
7.Cooperate le CCD positioning system ho finyella litlhoko tsa tlhahiso e kholo mecheng ea likopano;
8.UPH ≥ lintlha tsa 8000, lihlahisoa ≥ 99% (tse amanang le thepa ea lihlahisoa le ho tsitsisa).