Aluminium Wire Bonding Machine bakeng sa TO Series Wire Bonding -Wedge Bonding ICs/GR-W02

Mochini o khethehileng oa terata o nang le mohala o le mong TO;

GR-W02 ke mochini o kopanyang terata o loketseng lisebelisoa tsa matla, sehlahisoa se lumellana le mola o le mong ho ea ho liphutheloana le moralo oa li-ultrasonic tse ngata, bonder e sebelisoa kamora palo e kholo ea ntlafatso e pheta-phetoang, e sebelisa li-motor tse tsitsitseng le tse tšepahalang, coil ea lentsoe. li-motors, litsamaiso tsa ultrasonic bakeng sa tlhahiso. Ho phaella moo, bokhoni bo atolositsoeng ba ho lemoha mokhoa oa sesebelisoa bo fana ka tlhahiso le ho tšepahala ho indasteri.

Re romelle lengolo-tsoibila

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Libetri tsa matla a macha, li-inverters tsa photovoltaic, lisebelisoa tsa elektroniki tsa likoloi, polokelo ea matla, IGBT, liboto tsa taolo ea polokeho ea betri ea BMS, jj.

Tlhaloso ea Sehlahisoa

Mohlala	GR-W02
Ultrasound bonding repetitive positioning	± 0.02mm, ho kenyeletsoa setšoantšo/letoto/chopa/tshebediso
Mohala oa terata oa aluminium o sebetsang	5-20mil
Sistimi ea pono	Multi-function e ntlafalitsoeng mokhoa oa ho lemoha mohlala
Lemoha mekhoa	Ho Fumana Karolo, Ntlha e le 'Ngoe PR & Angle
XY mefuta e fapaneng ea ho sisinyeha	100mm(X) x 100mm(Y)
XY ho nepahala ha motsamao	Qeto ea mohala oa mola oa 0.1um
Litlhoko tsa matla	Motlakase 180~240V AC mohato o le mong, 50/60HZ, 4.0kVA
Litekanyo tsa sesebelisoa	0-200000cps
Mocheso oa mocheso oa sekhomaretsi	1820mm x1260mm x 1700mm
Ho tsamaea le ho nepahala ha Z-axis	Enjene ea coil ea lentsoe, maeto a 50mm Z-axis, qeto ea 0.1um
R-axis	Torque motor e tsamaisoang ke ± 220 °, qeto ea 0.1um
Li-transducers	Khafetsa: 60KHz/80KHz, impedance 10~80 ohms
Khatello ea tlamahano	50 ~ 1000g, e ka lokisetsoang; Ho nepahala±3g
Tsamaiso ea taolo	Indasteri PC + servo
Ho fumana mohala o khaotsoeng oa mochine o kenang	Sistimi ea ho kena ha cable e tlase
Khatello ea moea e hatisitsoeng / boikhethelo	0.5 ~ 0.7MPa, moea o hloekileng o omileng
boima	1200kg

Sehlahisoa Tšobotsi

1. Ho sebelisa linear motor drive system, automatic PR alignment fast bonding
2. Mokhoa o ikemetseng oa ho etsa lipatlisiso le nts'etsopele, mokhoa o tsitsitseng oa ho kopanya
3. Boemo bo tsamaeang ka potlako, theknoloji e tsitsitseng ea ho laola matla

Lintlha-khōlō Tsa Sebopeho

1. New intša ntshetswa pele bonding tjheseletsa kopanelo, tshebetso le amahanngoa machaba
2. Sebopeho sa graphical se hlakile ebile sea utloahala, 'me litlhophiso tsa paramethara tsa sebopeho sa ts'ebetso lia bonoa.
3. Mochini oohle o na le ts'ebetso ea ts'ebetso ea tlhaiso-leseling ea sehlahisoa mme e ka etsoa tharollo ea EMS
4. Patlisiso e ikemetseng le nts'etsopele le moralo oa thekenoloji ea karolo ea mantlha, boikemelo bo ikemetseng ba sistimi ea ultrasonic
5. Hlakola mokhoa oa setso oa ts'ebetso le taolo 'me u nke taolo ea mokhoa oa libese o thibelang tšitiso
E ka tsamaisana le sethala sefe kapa sefe sa ho tsamaisa le ho tsamaisa 'marakeng.

Kenya lintlha-khōlō

1. Patlisiso e ikemetseng le nts'etsopele le moralo oa thekenoloji ea karolo ea mantlha, boikemelo bo ikemetseng ba sistimi ea ultrasonic
2. Hlakola mokhoa o tloaelehileng oa taolo ea ts'ebetso 'me u nke taolo ea libese tse thibelang tšitiso
3. SEBAKA SA BONDING 100MM X 100MM, E KA BOND DOUBLE ROW KAPA MELA-MULTI HO
4. Sistimi e ka lekanya le ho lekanya ts'ebetso ea khatello ea hlooho ea welding, e ka fetoloang ka senotlolo se le seng.

Sesebelisoa se lumellana

1. Mokhoa o mocha oa ho khanna oa linear oa XYZR, botsitso bo matla ntle le phetoho
2. E lumellana le mefuta e fapaneng ea liphutheloana le litlhaloso tsa lisebelisoa tsa motlakase, lisebelisoa tse ncha tse potlakileng, joalo-joalo
3. MOS TO220,TO220F,TO252,T0247,TO263,TO-3P

E fetileng: Keletso ea Robot e Tala ea Automatic Soldering—911G Series

E 'ngoe: Semiconductor IC Bonding Equipment/Aluminium Wedge Bonding Machine GR-W01

Ngola molaetsa wa hao mona mme o re romele wona